To receive competitive purchasing options on part number X28256EMB-25 by Xicor Inc, look no further than NSN Direct. For your reference, this item has the NSN 5962-01-359-5490 and is listed with the description “Microcircuit Memory.” If this matches your needs, we encourage you to fill out the partially-completed quote request form on this page to kick off procurement. By providing comprehensive information about your requirements, such as your desired quantity, pricing, and fulfillment speed, our experts can formulate the most fitting solutions for you. We want to ensure that this process is quick and effortless, so we routinely respond to requests within 15 minutes of receiving and reviewing them.
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In addition to our streamlined quotation service, we also aim to make the process of finding products simple. As such, if you require other Xicor Inc parts produced under the CAGE Code 60395, you can peruse our manufacturer or CAGE Code catalogs, or use our search engine and filters. Furthermore, if you want to locate items similar to part number X28256EMB-25, you can glean from the first four digits of its NSN 5962-01-359-5490 that it belongs to the FSC 5962 Microcircuits Electronic. This being said, do not hesitate to request quotes on part number X28256EMB-25 and any other NSN parts that we feature to experience unrivaled procurement.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-359-5490 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013595490 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-8764903YA | 1 | 8 | E |
| MRC | Criteria | Characteristic |
|---|---|---|
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS NOMINAL ACCESS |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| CBBL | FEATURES PROVIDED | W/ENABLE AND W/DISABLE AND W/CLEAR AND MONOLITHIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 6.25 VOLTS MAXIMUM POWER SOURCE |
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 80.00 MILLIAMPERES MAXIMUM SUPPLY |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 10.00 INPUT PICOFARADS MAXIMUM AND 10.00 OUTPUT PICOFARADS MAXIMUM |
| CZER | MEMORY DEVICE TYPE | EEPROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
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